Blind & Buried Via

When PCB space is limited, or you're working with tight plated through hole constraints, Blind and Buried Vias may be the answer.

Blind & Buried Via technology has played a pivotal role in squeezing more capability into a smaller space. By shortening vias to only pass through necessary layers, more surface area become available for components.

Key benefits include:

1.Ability to meet the density constraints of lines and pads on a typical design without increasing the layer count or board size

2.PCB aspect ratio reduction , make it easier to make copper plating through .

Blind Via is a copper plated hole that connects only one outer layer to one or more inner layers. A blind via never goes all the way through a circuit board. So it’s called “blind”. In terms of design, blind vias are defined in a separate drill file. 

Additional Benefit of Blind Vias:

Ability to widen BGA breakout channel (layer count reduction)