Maximum active pcb size: 560 mm x 622 mm

Materials: High Tg Fr4, Polyimide, PTFE, Halogen free,High Frequency , metal substrate

Solder resists: Liquid photo-imageable, colours: green, red, blue, black, white etc. Cover film.

Legend inks: white standard, yellow

Multi-layer: layer counts from 1 to 24 layers

PCB thicknesses from 0.2mm to 6.0 mm

Copper weights: 1/2 oz to 4 oz

PCB finishes: HASL,ENIG,OSP,ENEPIG,Immersion Silver,Immersion Tin etc.

Min track and gap: 3.0/3.0 mil .

Smallest drill at size: 0.2mm Smallest

Laser drilling size : 0.1MM

Minimum recommended gap between SMD pads: 0.12mm

Minimum solder resist to copper clearance: 0.1 mm

Maximum plated hole depth to diameter aspect ratio : 20:1

Mechanical: edge chamfering, counter-sinking, counter-boring, routing, scoring all available.

Special treatment : Impedance , half plated holes , via in PAD , golden fingers , HDI etc.