Position accuracy：20 um

Components size：0.4×0.2mm(01005) —130×79mm，Flip-CHIP,QFP,BGA,POP

Max. component height:：25mm

Max. PCB size：680×500mm

Min.PCB size：no limited

PCB thickness：0.3 to 6mm

PCB weight：3KG

Wave-Solder

Max. PCB width：450mm

Min. PCB width: no limited

Component height：Top 120mm/Bot 15mm
Testing

ICT，Probe flying，burn-in，function test，temperature cycling