Our commitment is to assist small and mid-sized customers in reducing their cost by providing total solutions, high-mixed, low and medium volume services. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets . With our skilled program managers, process engineers, production personnel and procurement professionals, we are capable to fully understand and surpass your requirements.

Heng Hui manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion and finished product fabrication, testing , automatic spray coating and packing.

We work with our customers and suppliers to anticipate technology trends and quality assembly methods for new component packages, such as micro-BGAs (Ball Grid Array) and other products.  We are at the forefront in developing lead-free manufacturing techniques to help our customers comply with new environmental regulations.